Machines
  • Automatic Plating Line
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    • Copper Plating Machine
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    • Copper Plating Machine
    copper plating machineHJ Copper Plating Machine produces fine crystalline hard copper layers, which are ideal conditions for electromechanical engraving. This state-of-the-art machinery is based on the latest innovations in gravure cylinder copper plating. 
     

      ●  Compact design and small footprint
      ●  Single unit or to be integrated into automatic lines
      ●  Flexible modular adapter system
      ●  50% immersion for high current flow
      ●  Polypropylene tanks with high storage capacity
      ●  Current density range is from 20 - 25 A/dm² using standard hardness additives
      ●  Titanium anode basket with automatic adjustment
      ●  Easy operation for cleaning of anode and basket
      ●  Heating and Cooling systems for temperature control
      ●  Cartridge filter system with 7 candles
      ●  PLC operated machine with fully automatic calculation and control of all parameterscopper plating tank
      ●  Fully automatic process or manual operation
      ●  All Stainless steel machine housing
      ●  Optional: Copper reduction unit with insoluble anode
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